Rigid Boards
- Layer count: 4-40 layers.
- Type: BGA, CSP substrates, Ultra-thin.
- Pitch: 100 micron outer layers. 80 micron inner layers.
- Through Holes: Less than 200 micron.
- Bind and Buried Via: Less than 100 micron.
- Solder Mask: Liquid, zero clearance (zero gap)
- Surface Finish: Hard gold, soft gold, OSP, Lead free.
- Bump Formation: Various shapes at 70 microns out of solder, copper, gold.
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