Flex Circuits

• Single Sided, Double Sided, Multi-layer and Rigid-flex.
• TAB: Single layer and double layer.
• Materials: Ployimide base and Polyester base. Adhesive and adhesiveless types.
• Pitch: 30-50 micron single sided with flying leads. 50-60 micron double sided with flying leads.
• Via size: Less than 100 micron for through holes. Less than 60 micron for blind via holes.
• Coverlay: Film and liquid coverlay. Photo-imageable and laser drilling.
• Surface Finish Hard gold, soft gold, OSP, lead-free.
• Bump Forming: 70 micron pitch with solder, gold, other.

50micron pitch