Japanese

2006 Global Material Projection for Flexible Circuits

The Material study is a follow on to our 2006 Global Projection of Flex Circuits. DKN Research performed a detailed examination of the materials utilized (PI, PET, PEEK, ect.), the means of producing these materials (lamination, cast, sputtered, ect.) the densities of the circuit traces and the volume of material used in each application. The five years projections were estimated for the individual materials including liquid base polyimide.

Additionally, adhesive and adhesiveless based systems are examined along with various circuit formation techniques (subtractive, semi-additive and full additive). Furthermore, supplemental materials such as coverlay (film, liquid, photoimageable), bonding materials, etc. are included in the projection study.

The study is designed to assist in the understanding of what is currently being used and the direction the industry is moving. As a manufacturer, knowing what will be required in the future will help formulate not only a technology roadmap for the company but also a procurement direction to keep up with industry demands.

DKN Research can also provide custom-made studies such as the demand of various film thicknesses and the ratio of single side and double side according to the specific interest of the client.

Contents:

• Introduction of the materials for flexible circuits
• Basic Materials
  
• Flexible Copper Laminates
  
• Coverlay
  
  
• Global Flexible Circuit Projection by Base Materials
  
• Polyimide Base Flexible Circuits
  
• Advanced Polyimide Base Flexible Circuits
  
• Polyester Base Flexible Circuits
  
  
• Material Projections
  
• Flexible copper laminates
  
• Adhesive Base Laminates
  
• Adhesiveless laminate made by casting and lamination
  
• Adhesiveless laminate made by sputtering/plating
  
• Liquid polyimide resins and polyimide films
  
• Total volume of the flexible base materials
  
• Coverlay & Supplemental Materials
  

18 graphs for the projections with numerical data
8 Figures for the introductions of the materials

Cost of the reports

• Demands of all flexible materials: $1,500.00
• Demands of the base materials (dielectric materials): $400.00
  
• Demands of the laminates: $900.00
  
• Demands of the coverlay materials: $500.00
  

**The cost of the supplemental studies will be quoted by request.