Engineering & Consulting

The World Finest Printed Circuits & Packaging

R&D Services

DKN Research has been working with world class manufacturing to develope leading edge technologies for the electronics packaging and printed circuit industries. High density flex circuity is a specific area of experience and expertise resident within DKN Research. Additionally, we can provide the upfront research into developing new technolgies to meet specific customer demands when no existing manufacturer is capable of providing this service to the customer. Ultra-high density pitch, Miro-via holes, Micro-bump generation and high density interconnects are services redily available.
See the Products section for specific descriptions.

Engineering Support

With years of manufacturing experience, DKN Research is able to assist both circuit board manufactures and end customers. With the vendor we can define process controls to increase yields and with the customer we can guide them in the specication of the product to achieve performance while maintaing cost goals. Working with capital equipment manufacurers we are able to help design processes that both produce deifined results at reduced costs.

Consulting Services

Understanding both the business model and the manufacturing cycles DKN Research can provide a cost effective solution to production of printed wiring boards and electronic packaging. Plans for the entire manufacturing of rigid boards, flex and rigid-flex circuits can be provided. This includes plant lay-out, equipment selection and procurement, installation, and on-site management. Business planning and direction, manufacturing controls and engineering guidance are all available.