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Archives

Archives of DKN Research

News

- Under Construction

EPTE Newsletter

- Under Construction

Books

  1. “Easy Understanding Series, How to Make IC Packages”, (Japanese only), Jan Vardaman & Dominique Numakura, Nikkan Kogyo Shinbun, December, 2005, 1800 yens.
  2. “Easy understanding Series, How to Use Flexible Circuits”, (Japanese only), Dominique Numakura, Nikkan Kogyo Shinbun, December, 2005, 1800 yens.
  3. “The Latest Technology Trends of the High Density Electronic Circuits”, Dominique Numakura, Denshi Zairyo, the Special Edition of Jisso Guidebook, July, 2005
  4. “The Latest Trend of EMS Companies” Dominique Numakura, 2005 Annual Book of Printed Circuit Manufacturers, Sangyo Times, June 2005.
  5. “Easy Understanding Series, How to Make Flexible Circuits”, (Japanese only), Dominique Numakura, Nikkan Kogyo Shinbun, June, 2004, 1800 yens.
  6. “Coomb’s Printed Circuit Handbook, 5th Edition”, Dominique Numakura,
    McGrow Hill, 2001
  7. “Introduction of high Density Flexible Circuits”, (Japanese only) Dominique Numakura, Nikkan Kogyo Shinbun, 1998

Articles

Articles for the Major Industrial Magazines

  1. “The Global Business & Technology Trends of the Flexible Circuits, Roadmap for the High-Density Advanced Flexible Circuits”, Robert Turunen and Dominique Numakura, TPCA Journal, February, 2006
  2. “The Global PWB Projection for 2006”, Dominique Numakura, KPCA Magazine, November, 2005 (Korean language)
  3. “The Global Business Trends of the Flexible Circuits, Direction to the High-Density Advanced Flexible Circuits”, Dominique Numakura, KPCA Magazine, August, 2005 (Korean language)
  4. “Asia: Supply and Market”, Robert Turunen, Dominique Numakura, PCD&M, February. 2005.

 

Series of the Technical Articles

  1. “The latest semiconductor package, Part IV”, Dominique Numakura, Electronics Packaging Technology, February, 2006
  2. “The latest semiconductor package, Part III”, Dominique Numakura, Electronics Packaging Technology, January, 2006
  3. “The latest semiconductor package, Part II”, Dominique Numakura, Electronics Packaging Technology, December, 2005
  4. “The latest semiconductor package, Part I”, Dominique Numakura, Electronics Packaging Technology, November, 2005
  5. “New Materials for the Ultra-High Density Circuits”, Dominique Numakura, Electronics Packaging Technology, November, 2005
  6. “Manufacturing of the Ultra High Density Multi-Layer Circuits by Semi-
    Additive Process”, Dominique Numakura, Electronics Packaging Technology, September, 2005
  7. “Manufacturing of the Ultra High Density Multi-Layer Circuits by Semi-
    Additive Process”, Dominique Numakura, Electronics Packaging Technology, August, 2005
  8. “Manufacturing of the Ultra High Density Double and Multi-layer Circuits by Full-Additive Process”, Dominique Numakura, Electronics Packaging Technology, July, 2005
  9. “Insides of the advanced Packaging, #4:The generation of fine traces, the limit of the subtractive process and the possibilities of the additive process”, Dominique Numakura, Electronic Packaging Technology, June 2005
  10. “Insides of the advanced Packaging, #3:The generation of fine traces, the limit of the subtractive process and the possibilities of the additive process”, Dominique Numakura, Electronic Packaging Technology, May 2005

Presentation

Presentation Materials for the Major Conferences

  1. “The Global Technology Trends of the Flexible Circuits, Roadmap for the Ultra High-Density Advanced Flexible Circuits”, Dominique Numakura, April 21st, 2005, Technical Symposium of KPCA Show 2005, Seoul, Korea
  2. “Technical Roadmap of High Density Interconnects with Flexible Substrates in Portable Electronics”, Robert Turunen & Dominique Numakura, PCB Design Conference West, Mar. 10, 2005, Santa Clara
  3. “Micro Bump Array Constructions on the Organic Substrates for the Non-Permanent Terminations”, Robert Turunen & Dominique Numakura, 10th Electronic Circuit World Convention, Anaheim, Feb. 24, 2005.
  4. “The Global Technology Trends of the Flexible Circuits.” - Roadmap for the Ultra High-Density Advanced Flexible Circuits - Dominique Numakura, January 19th, 2005, 6th Printed Wiring Boards Expo, Tokyo Big Sight, Japan
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