Japanese

Now Available!:
News Release ：Fine Line Trial Kit 01-04-2010 [PDF]
Fine Line Trial Kit Information[PDF]

Now Available!:
News Release： Fine Silver Technology 11-12-2009 [PDF]

Now Available!:
Design Guide for Printable Flexible Electronics [PDF]

Now Available!:
Introduction of Printable Flexible Electronics [PDF]

News Release : Printable Electronics [PDF]
Total Printing Process Technologies for Advanced High Density Printable Flexible Electronics

News Release : Film Connectors [PDF]
Film Connectors for Ultra Thin Connections In High Density Flexible Circuits

Now Available!:
2006 Global Projection of Flexible Circuits

Now Available!:
2006 Global Material Projection for Flexible Circuits

WELCOME TO DKN RESEARCH

WHY DON'T YOU TRY THE WORLD FINEST PACKAGING TECHNOLOGIES FOR YOUR NEXT GENERATION PRODUCTS?

DKN Research is the global leader in the engineering of the high density elecronic packaging and printed circuits. DKN Research will be able to provide the best solutions for the customer's difficult requirements.

Our Advanced Technology

Click Photo for more information!